Size: 210mm×210mm (diameter 295±0.25mm) Thickness (battery): 170 ± 20 μm Front (-): silicon dioxide plus silicon nitride blue composite anti-reflection film (PID Free); three-segment design, 9 main grids, 120-180 sub grids; main grid width 0.06±0.02mm, main grid The grid is three-sectioned, with two large bifurcations at both ends, and a single busbar has 6 large bifurcations. The size of the large bifurcations is (1.5±0.1mm)×(7.2±0.1)mm, and there are 12 welding points at the connection between the busbar and the fine grid. Point, solder joint size (1.5 ± 0.15) mm × (1.0 ± 0.15) mm. Back (+): Alumina and silicon nitride composite layer; back electrode consists of 9 back composite busbars and 150-250 Al gridlines; nine-segment 1.8±0.2 mm Ag electrode.